Thermal fillers: AL, AS, CB, UHP
Showa Denko manufactures several kinds of alumina and hexagonal boron nitride. These have excellent characteristics for rubber and resin based thermal conductive fillers.
SHOBN™, our UHP series is a high purity crystalized Hexagonal Boron Nitride. SHOBN™ has excellent thermal conductivity, high thermal stability, corrosion resistance, and good electrical characteristics (high electrical insulation, low dielectric constant). The UHP series is used for high heat radiation applications which require electrical insulation.
The AS series is a single grain corundum with less crystal edges. Since the AS series has a large particle diameter and broad particle size distribution, it excels at filling resins and producing compounds with low viscosity and good fluidity.
Alunabeads™, also known as our CB series, is a spherical single grained alumina. Alunabeads™ has similar characteristics to the AS series. CB produces compounds with high filling rates and good viscosity. The CB series has various particle sizes and particle distributions available.
The AL series is aluminium oxide which has reduced soda content, controlled by our proprietary technology. The AL series has several ultimate crystal sizes, shapes, and particle size distributions in production. Extra fine alumina particles are used as an ingredient in resins alongside coarse ingredients.